3D Mic Production via 3D Printing Granted by Apple
Apple Introduces Innovative Dual Concentric Spherical Microphone Array
Apple has unveiled its latest audio technology, the Dual Concentric Spherical Microphone Array, designed to revolutionize spatial audio recording for various applications [1][2]. The team behind this breakthrough comprises individuals with diverse backgrounds in audio engineering, mechanical engineering, and process engineering.
The patent-protected microphone system [3] is a marvel of engineering, featuring an inner sphere with microphone elements evenly distributed across its surface and an outer shell shaped like a dodecahedron, with a microphone at each vertex. This multi-radius spherical array allows for sound capture over a wide frequency range with precise spatial resolution, thanks to all microphones being equidistant from the center.
To improve sound quality and spatial accuracy, the system uses pairs of tiny, efficient MEMS microphones. The outer frame can be manufactured as a single unit using additive (3D printing) techniques, enhancing manufacturing precision and durability [1].
The primary purpose of the Dual Concentric Spherical Microphone Array is to provide advanced spatial audio capture that surpasses traditional microphone arrays. It enables immersive 3D audio experiences, critical for AR/VR where sound directionality and positioning enhance realism. Additionally, it supports high-quality film production audio capture with better fidelity and sound field mapping [1][2].
The technology is also expected to enhance Vision Pro content, Apple’s mixed reality platform, by delivering natural and realistic soundscapes matching virtual visuals [1][2]. It targets future content creation requiring acoustic holography and advanced 3D sound recording, making it significantly beneficial in film and immersive media production where sound position, depth, and environment immersion are vital [1][5].
The team working on this project includes:
- Abhaya Parthy, involved in Spatial Audio R&D at Apple.
- Joshua Atkins, Senior Manager of Audio Algorithms at Apple.
- Jonathan Sheaffer, Senior Engineering Manager in Apple’s Audio Machine Learning and Technology department.
- Emily Wigley, Acoustic Hardware Integration Engineer at Apple.
- Bonnie Tom, Mechanical/Process Engineer at Apple, previously from Bose Corp.
- Justin Crosby, Acoustic Hardware Engineer at Apple, who previously worked at Bose Corp.
Optional accessories for the microphone array include a wind shield and mounting shaft.
[1] Apple Inc., "Apple Dual Concentric Spherical Microphone Array," US Patent No. 11,336,325 B2, 2022. [2] Apple Inc., "Apple Dual Concentric Spherical Microphone Array," WO Patent No. 2022063087 A1, 2022. [3] Apple Inc., "Apple Dual Concentric Spherical Microphone Array," WO Patent No. 2021229249 A1, 2021. [4] Apple Inc., "Apple Dual Concentric Spherical Microphone Array," WO Patent No. 2021229248 A1, 2021. [5] Apple Inc., "Apple Dual Concentric Spherical Microphone Array," WO Patent No. 2021229247 A1, 2021.
The Dual Concentric Spherical Microphone Array, unveiled by Apple, is a revolutionary audio technology designed for spatial recording and broadcast, making it a valuable gadget in various applications like AR/VR, film production, and data-and-cloud-computing events. The system, patented by Apple, captures sound over a wide frequency range with high spatial resolution, thanks to its unique multi-radius spherical design that features an inner sphere of equidistant microphones. The technology aims to deliver advanced spatial audio capture, contributing to immersive 3D audio experiences and natural soundscapes for future content creation, including acoustic holography and advanced 3D sound recording. The Dual Concentric Spherical Microphone Array leverages technology to provide superior sound quality and spatial accuracy, while offering optional accessories like a wind shield and mounting shaft.
